Cure and Inert Oven, 2-chamber type

Cure for BGA/CSP (PBGA/CABG/LFBGA/SBGA/TABGA/FilipChip) manufacturing process.

• Expandable and detachable
• Can select number of ovens
• Saving space in factory
• Easy maintenance
• Oxygen exchange rate is under 100 ppm level for Inert
• Cooling Time (175C to 50C) - less than 30min for Inert

Methood : Forced convection
Temp. range : 40 to 260 deg.C
Temp. uniformity : ±3deg.C with sample Loading
Internal dimension : W580 x D615 x H580

Other :
Auto damper with Exhaust duct
N2 gas inlet port
Solenoid door lock
Level adjustable shelf
Program security function