| Thank you for your visit 33rd INTERNEPCOM JAPAN |
The exhibition of “Internepcon Japan”, covering electronics devices, manufacturing, and packaging, was held for 3 days on January 28 (Wed.) - 30 (Fri.), 2004 at Tokyo Big Sight. (Internepcon Japan is mainly an exhibition for IC packaging technology.)
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In collaboration with Fine Tech Products of Hitachi Kenki, we exhibited “Plasma Dry Cleaning & Etching Equipment” as inspection instrument for completed products and the manufacturing process of semi-conductors, “Non-destructive inspection evaluation analyzer” as high-resolution image ultra sonic analyzer, surface analyzer, etc (For exhibit products, click here).
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| We express our thanks for the many visitors to our booths during the period. You will be kept updated and informed about solutions, available assistance, proposals etc. |
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| Visitors number (Announced by the organizer): 28th day=15,843, 29th day=18,815, 30th day=21,313 |
 Our booths at Internepcon Japan (January 28 to 30, 2004)
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| Questions and comments on this matter: Contact Mr. I. Nakayama, Electronics Sales Department |
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